New Technology Has Dramatic Chip-Cooling Potential for Future Computers Purdue University News (08/13/07) Venere, Emil
as it appeared in the August 15, 2007 edition of ACM TechNews.
Purdue University researchers have demonstrated new technology that uses tiny "ionic wind engines" to increase the heat-transfer coefficient of computer chips by as much as 250 percent. "Other experimental cooling-enhancement approaches might give you a 40 percent or 50 percent improvement," says professor of mechanical engineering Suresh Garimella. "A 250 percent improvement is quite unusual." The experimental cooling device generates ions using electrodes placed near one another, a positively charged wire, or anode, and negatively charged electrodes, or cathodes. The anode is positioned about 10 millimeters above the cathodes. When voltage passed through the device, the cathodes discharged electrons toward the anode. While moving from the cathodes to the anode, the electrons collide with air molecules, creating positively charged ions, which are attracted back to the cathodes, creating an "ionic wind," increasing the airflow to the surface of the chip. When combined with an ordinary fan to provide a constant stream of fresh air molecules, the ionic wind engines significantly improve chip temperature. Infrared imaging showed that ionic wind reduced the temperature from 140 degrees Fahrenheit to 95 degrees F. "This technology is very exciting and innovative," says Intel research engineer Rajiv Mongia. "It has the potential of enabling imaginative notebook and handheld PC designs in the future." Click Here to View Full Article
